Multiple (reusable/leaf) IC packaging for other server environments
Packaging into image components for non-MVS server environments is similar to the dual load module approach, though it differs as follows:
• You make one or more reusable modules (ICs) which contain Kernel and other Smalltalk classes, rather than one base load module.
• The Smalltalk virtual machine (VM) is not packaged with the base ICs.
• You make one or more leaf modules (ICs) which contain startup and other code specific to your application(s), rather than dependent load modules. The leaf ICs use the code in the reusable ICs.
For extensive information on making reusable and leaf ICs, refer to the Smalltalk User Guide.
Last modified date: 07/24/2020